In this section
@inproceedings{Lambinet:2017:www.scientific.net/KEM.754.359,
author = {Lambinet, F and Khodaei, ZS},
doi = {www.scientific.net/KEM.754.359},
pages = {359--362},
publisher = {Trans Tech Publications},
title = {Smart patch repair with low profile PVDF sensors},
url = {http://dx.doi.org/10.4028/www.scientific.net/KEM.754.359},
year = {2017}
}
TY - CPAPER
AB - Bonded repair of composite structures still remains a major concern for the airworthiness authorities because of the uncertainty about the repair quality. This work, investigates the applicability of conventional Structural Health Monitoring (SHM) techniques for monitoring of bonded repair with ring-shaped low profile sensors. A repaired composite panel has been sensorized with two Ring-Shaped Polyvinylidene fluoride piezopolymer Sensors (RSPS) and a piezoelectric (PZT) transducer. An electromechanical impedance (EMI) and Lamb wave analysis have been carried out to check the sensitivity of these sensors to detect an artificially introduced damage simulating a disbond of the repair. The state of the repair have been successfully monitored and reported by both methods.
AU - Lambinet,F
AU - Khodaei,ZS
DO - www.scientific.net/KEM.754.359
EP - 362
PB - Trans Tech Publications
PY - 2017///
SN - 1013-9826
SP - 359
TI - Smart patch repair with low profile PVDF sensors
UR - http://dx.doi.org/10.4028/www.scientific.net/KEM.754.359
UR - http://hdl.handle.net/10044/1/62834
ER -
