BibTex format
@article{Del:2019:10.1007/s11664-019-07452-8,
author = {Del, Carro L and Zinn, AA and Ruch, P and Bouville, F and Studart, AR and Brunschwiler, T},
doi = {10.1007/s11664-019-07452-8},
journal = {Journal of Electronic Materials},
pages = {6823--6834},
title = {Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices},
url = {http://dx.doi.org/10.1007/s11664-019-07452-8},
volume = {48},
year = {2019}
}
RIS format (EndNote, RefMan)
TY - JOUR
AU - Del,Carro L
AU - Zinn,AA
AU - Ruch,P
AU - Bouville,F
AU - Studart,AR
AU - Brunschwiler,T
DO - 10.1007/s11664-019-07452-8
EP - 6834
PY - 2019///
SN - 0361-5235
SP - 6823
TI - Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
T2 - Journal of Electronic Materials
UR - http://dx.doi.org/10.1007/s11664-019-07452-8
VL - 48
ER -