In this section
@inproceedings{Haci:2019:10.1109/BIOCAS.2019.8918756,
author = {Haci, D and Mifsud, A and Liu, Y and Ghoreishizadeh, S and Constandinou, T},
doi = {10.1109/BIOCAS.2019.8918756},
pages = {1--4},
publisher = {IEEE},
title = {In-body wireline interfacing platform for multi-module implantable microsystems},
url = {http://dx.doi.org/10.1109/BIOCAS.2019.8918756},
year = {2019}
}
TY - CPAPER
AB - The recent evolution of implantable medical devicesfrom single-unit stimulators to modern implantable microsys-tems, has driven the need for distributed technologies, in whichboth the implant system and functions are partitioned across mul-tiple active devices. This multi-module approach is made possiblethanks to novel network architectures, allowing for in-body powerand data communications to be performed using implantableleads. This paper discusses the challenges in implementing suchinterfacing system and presents a platform based on one centralimplant (CI) and multiple peripheral implants (PIs) using a cus-tom 4WiCS communication protocol. This is implemented in PCBtechnology and tested to demonstrate intrabody communicationcapabilities and power transfer within the network. Measuredresults show CI-to-PI power delivery achieves 70%efficiency inexpected load condition, while establishing full-duplex data linkwith up to 4 PIs simultaneously.
AU - Haci,D
AU - Mifsud,A
AU - Liu,Y
AU - Ghoreishizadeh,S
AU - Constandinou,T
DO - 10.1109/BIOCAS.2019.8918756
EP - 4
PB - IEEE
PY - 2019///
SP - 1
TI - In-body wireline interfacing platform for multi-module implantable microsystems
UR - http://dx.doi.org/10.1109/BIOCAS.2019.8918756
UR - https://ieeexplore.ieee.org/abstract/document/8918756
UR - http://hdl.handle.net/10044/1/74991
ER -