In this section
@article{Hall:2021:10.1109/TBCAS.2021.3052970,
author = {Hall, T and Cegla, F and van, Arkel RJ},
doi = {10.1109/TBCAS.2021.3052970},
journal = {IEEE Transactions on Biomedical Circuits and Systems},
pages = {102--110},
title = {Simple smart implants: simultaneous monitoring of loosening and temperature in orthopaedics with an embedded ultrasound transducer},
url = {http://dx.doi.org/10.1109/TBCAS.2021.3052970},
volume = {15},
year = {2021}
}
TY - JOUR
AB - Implant failure can have devastating consequences on patient outcomes following joint replacement. Time to diagnosis affects subsequent treatment success, but current diagnostics do not give early warning and lack accuracy. This research proposes an embedded ultrasound system to monitor implant fixation and temperature – a potential indicator of infection. Requiring only two implanted components: a piezoelectric transducer and a coil, pulse-echo responses are elicited via a three-coil inductive link. This passive system avoids the need for batteries, energy harvesters, and microprocessors, resulting in minimal changes to existing implant architecture. Proof-of-concept was demonstrated in vitro for a titanium plate cemented into synthetic bone, using a small embedded coil with 10 mm diameter. Gross loosening – simulated by completely debonding the implant-cement interface – was detectable with 95% confidence at up to 12 mm implantation depth. Temperature was calibrated with root mean square error of 0.19 °C at 5 mm, with measurements accurate to ±1 °C with 95% confidence up to 6 mm implantation depth. These data demonstrate that with only a transducer and coil implanted, it is possible to measure fixation and temperature simultaneously. This simple smart implant approach minimises the need to modify well-established implant designs, and hence could enable mass-market adoption.
AU - Hall,T
AU - Cegla,F
AU - van,Arkel RJ
DO - 10.1109/TBCAS.2021.3052970
EP - 110
PY - 2021///
SN - 1932-4545
SP - 102
TI - Simple smart implants: simultaneous monitoring of loosening and temperature in orthopaedics with an embedded ultrasound transducer
T2 - IEEE Transactions on Biomedical Circuits and Systems
UR - http://dx.doi.org/10.1109/TBCAS.2021.3052970
UR - https://ieeexplore.ieee.org/document/9329118
UR - http://hdl.handle.net/10044/1/86906
VL - 15
ER -
The Biomechanics Group
Mechanical Engineering
Imperial College London
South Kensington Campus
City & Guilds Building
Exhibition Road
London SW7 2AZ
+44 (0) 20 7589 5111