BibTex format
@inproceedings{Szostak:2018:10.1109/EMBC.2018.8513272,
author = {Szostak, KM and Constandinou, TG},
doi = {10.1109/EMBC.2018.8513272},
publisher = {IEEE},
title = {Hermetic packaging for implantable microsystems: effectiveness of sequentially electroplated AuSn alloy},
url = {http://dx.doi.org/10.1109/EMBC.2018.8513272},
year = {2018}
}