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@inproceedings{Luan:2011:10.1109/ISCAS.2011.5938136,
author = {Luan, S and Eftekhar, A and Murphy, O and Constandinou, TG},
doi = {10.1109/ISCAS.2011.5938136},
pages = {7--10},
publisher = {IEEE},
title = {Towards an Inductively Coupled Power/Data Link for Bondpad-Less Silicon Chips},
url = {http://dx.doi.org/10.1109/ISCAS.2011.5938136},
year = {2011}
}

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TY  - CPAPER
AB  - This paper explores the concept of developing a bondpad-less fullyintegrated inductive link for power/data transfer between a silicon chip and a PCB. A key feature of the implemented system is that it requires no off-chip components. The proposed chip uses a standard 0.35um process and occupies an area of 2.5 x 2.5 mm^2. 9mW power was designed to be obtained on-chip through 900MHz carrier wave. Binary Phase Shift Keying (BPSK) and Load shift keying (LSK) are used for the the PCB-to-chip and chip-to-PCB link respectively for half-duplex communication.
AU  - Luan,S
AU  - Eftekhar,A
AU  - Murphy,O
AU  - Constandinou,TG
DO  - 10.1109/ISCAS.2011.5938136
EP  - 10
PB  - IEEE
PY  - 2011///
SP  - 7
TI  - Towards an Inductively Coupled Power/Data Link for Bondpad-Less Silicon Chips
UR  - http://dx.doi.org/10.1109/ISCAS.2011.5938136
UR  - http://ieeexplore.ieee.org/
UR  - http://hdl.handle.net/10044/1/6895
ER  -

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