BibTex format
@article{Szostak:2021:1361-6439/ac12a1,
author = {Szostak, KM and Keshavarz, M and Constandinou, T},
doi = {1361-6439/ac12a1},
journal = {Journal of Micromechanics and Microengineering},
pages = {1--13},
title = {Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices},
url = {http://dx.doi.org/10.1088/1361-6439/ac12a1},
volume = {31},
year = {2021}
}