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@inproceedings{Haci:2019:10.1109/BIOCAS.2019.8918756,
author = {Haci, D and Mifsud, A and Liu, Y and Ghoreishizadeh, S and Constandinou, T},
doi = {10.1109/BIOCAS.2019.8918756},
pages = {1--4},
publisher = {IEEE},
title = {In-body wireline interfacing platform for multi-module implantable microsystems},
url = {http://dx.doi.org/10.1109/BIOCAS.2019.8918756},
year = {2019}
}

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TY  - CPAPER
AB  - The recent evolution of implantable medical devicesfrom  single-unit  stimulators  to  modern  implantable  microsys-tems,  has  driven  the  need  for  distributed  technologies,  in  whichboth the implant system and functions are partitioned across mul-tiple active devices. This multi-module approach is made possiblethanks to novel network architectures, allowing for in-body powerand  data  communications  to  be  performed  using  implantableleads. This paper discusses the challenges in implementing suchinterfacing system and presents a platform based on one centralimplant (CI) and multiple peripheral implants (PIs) using a cus-tom 4WiCS communication protocol. This is implemented in PCBtechnology  and  tested  to  demonstrate  intrabody  communicationcapabilities  and  power  transfer  within  the  network.  Measuredresults show CI-to-PI power delivery achieves 70%efficiency inexpected  load  condition,  while  establishing  full-duplex  data  linkwith  up  to  4  PIs  simultaneously.
AU  - Haci,D
AU  - Mifsud,A
AU  - Liu,Y
AU  - Ghoreishizadeh,S
AU  - Constandinou,T
DO  - 10.1109/BIOCAS.2019.8918756
EP  - 4
PB  - IEEE
PY  - 2019///
SP  - 1
TI  - In-body wireline interfacing platform for multi-module implantable microsystems
UR  - http://dx.doi.org/10.1109/BIOCAS.2019.8918756
UR  - https://ieeexplore.ieee.org/abstract/document/8918756
UR  - http://hdl.handle.net/10044/1/74991
ER  -

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